（一）功能概述
        ISM-X3 是解決智能工廠內(nèi)錫膏類物料存儲、回溫、攪拌、追溯、管控、報廢等問題的錫膏生命管控系統(tǒng)，系統(tǒng)由智能錫膏存儲回溫攪拌設(shè)備和恩埃錫膏生命周期管理軟件組成。

        在實際生產(chǎn)中，系統(tǒng)會依據(jù)工單，錫膏生命周期管理軟件和智能錫膏存儲回溫攪拌設(shè)備智能交互，實現(xiàn)錫膏的智能存儲、智能回溫、智能攪拌，全流程無需人工干預(yù)，所有數(shù)據(jù)實時透明，并可隨時追溯查詢。

        智能錫膏存儲回溫攪拌設(shè)備內(nèi)置智能化的機(jī)械手臂，可將錫膏從冷藏區(qū)自動轉(zhuǎn)移到回溫區(qū)回溫，待回溫完畢將錫膏自動轉(zhuǎn)移到錫膏攪拌區(qū)攪拌，攪拌完畢后，將錫膏自動送至出口位置。錫膏生命周期管理軟件可精確管控每罐錫膏/紅膠的使用過程，并可提供 MySQL 的數(shù)據(jù)庫格式文件，為工廠的 MES，ERP，WMS 系統(tǒng)提供必要數(shù)據(jù)來源。

（1） Function Overview
ISM-X3 is a solder paste life control system that solves the problems of storing, reheating, stirring, tracing, controlling, and scrapping solder paste materials in intelligent factories. The system consists of intelligent solder paste storage and reheating stirring equipment and Enexi paste life cycle management software.
In actual production, the system will intelligently interact with the work order, solder paste lifecycle management software, and intelligent solder paste storage and heating mixing equipment to achieve intelligent storage, intelligent heating, and intelligent mixing of solder paste. The entire process does not require manual intervention, all data is real-time transparent, and can be traced and queried at any time.
The intelligent solder paste storage and temperature return mixing device is equipped with an intelligent robotic arm, which can automatically transfer the solder paste from the refrigeration area to the temperature return area for temperature return. After the temperature return is completed, the solder paste will be automatically transferred to the solder paste mixing area for mixing. After mixing, the solder paste will be automatically sent to the outlet position. The solder paste lifecycle management software can accurately control the usage process of each can of solder paste/red glue, and can provide MySQL database format files, providing necessary data sources for the factory's MES, ERP, and WMS systems.